Paras Semiconductors to invest ₹6,200 for greenfield OSAT facility in Madhya Pradesh

Paras Defence and Space Technologies on Wednesday said its subsidiary, Paras Semiconductors, would invest ₹6,200 crore to set up a greenfield integrated circuit (IC) packaging outsourced semiconductor assembly and test (OSAT) facility in the Indore-Ujjain region of Madhya Pradesh.

The facility will undertake advanced packaging operations including 3D heterogeneous integration, 2.5D/3D advanced packaging, hybrid bonding, ultra-high-density fan-out packaging, chiplet integration, wafer bumping, flip-chip assembly, testing and reliability, Paras said in a regulatory filing.

To this extent, Paras Semiconductors has signed a Memorandum of Understanding (MoU) with the state government’s Department of Science and Technology.

“Paras Semiconductors and MP State Electronics Development Corporation (MPSeDC) will integrate their respective expertise and resources to collaboratively facilitate the establishment of a greenfield advanced IC packaging OSAT in Madhya Pradesh,” Paras added.