Cadence launches AI agent for PCB, advanced packaging workflows
NEW DELHI: Semiconductor solutions provider Cadence Design Systems on Thursday launched the “AuraStack” AI agent to accelerate the design-to-manufacturing cycle for printed circuit board (PCB) makers and packaging companies.
The AI agent will be offered through the Cadence Allegro AI Studio.
Cadence said its AI agent, accelerated by Nvidia Blackwell and Nvidia CUDA-X, “coordinates domain-specific AI agents across planning, implementation, and tightly integrated multiphysics analysis domains to compress the system-design cycle through manufacturing”.
