Intel hires former SK hynix chief Lee Seok-hee to lead advanced packaging
Intel has appointed former CEO of SK hynix and SK On Lee Seok-hee as a senior vice president in its foundry business, amid the US chipmaker’s push into advanced semiconductor packaging.
According to a report by The Korea Herald, Intel announced Thursday that Lee will oversee advanced packaging, system integration, back-end technology development and back-end manufacturing at Intel Foundry. He will report directly to CEO Lip-Bu Tan.
Intel Foundry is establishing advanced packaging as a focused business with dedicated leadership, a direction underscored by Lee’s appointment to strengthen the division, the company explained.
