TSMC, Amkor sign 10-year deal to boost advanced chip packaging in US
Taipei [Taiwan], June 18 (ANI): Taiwan Semiconductor Manufacturing Co (TSMC) and US-based chip packaging and testing provider Amkor Technology have signed a 10-year agreement aimed at expanding advanced semiconductor packaging and testing capabilities in the United States, according to a news report by Focus Taiwan.
In a statement released Tuesday US time, Amkor said the partnership will support the development of a more integrated semiconductor supply chain in Arizona, where TSMC is investing heavily in chip manufacturing facilities, the report added.
