Intel taps industry veteran Seok-Hee Lee to lead foundry packaging push
Intel on Thursday named Seok-Hee Lee executive vice president of its contract chip-manufacturing division as it sharpens focus on its advanced packaging business.
The American chipmaker has been trying to reinvigorate its manufacturing business under CEO Lip-Bu Tan, after missing out on the AI boom.
The appointment follows President Donald Trump’s announcement earlier in the day that Apple had agreed to work with Intel to design and manufacture its chips in the U.S. in a boost to the chipmaker’s contract manufacturing business.
