SK hynix’s iHBM to cut thermal resistance by 30% to combat AI memory overheating

Seoul [South Korea], May 26 (ANI): SK hynix’s iHBM tackles heat choking next-gen high-bandwidth memory (HBM) by building cooling channels directly into its HBM chips. According to a news report by The Korea Herald on Tuesday, the South Korean chipmaker introduced this advanced packaging technology to combat rising temperatures, which represent a significant engineering obstacle that limits how far artificial intelligence memory scales.