Lam Research opens Austria lab to advance chip packaging, cut costs

Lam Research has opened a research lab in Salzburg, Austria, to advance a chip packaging technology that promises to increase chip density and cut costs, as the company looks to capitalize on surging AI demand for processors.

The US chipmaking tools supplier said ‌on Wednesday ⁠that the ⁠Salzburg facility will focus on panel-level packaging, which replaces the semiconductor industry’s traditional circular silicon wafers with square panels.