Paras Semiconductors, BroadPak join hands to build advanced semiconductor packaging capabilities
New Delhi, An Indian defence engineering company has joined hands with a US-based firm to accelerate the development of advanced semiconductor packaging capabilities in India, according to an official statement.
The collaboration will combine Paras Semiconductors’ manufacturing ambitions in opto-electronics, photonics and co-packaged optics with BroadPak’s technology expertise in advanced semiconductor packaging, heterogeneous integration and chiplet-based system architectures, it said.
