Samsung unveils 3D memory road map to tackle growing AI demands

Seoul [South Korea], September 1 (ANI): Samsung Electronics unveiled its next-generation memory strategy at Semicon Taiwan, banking on 3D architectures to enhance capacity, bandwidth, and energy efficiency amid mounting artificial intelligence workloads, according to a news report by The Korea Herald.

Choi Jang-seok, head of the memory product planning team at Samsung Electronics, presented the road map during a keynote speech at the Memory Executive Summit in Taipei. The company designated the strategy “CUBE,” an acronym for capacity, utilization, bandwidth, and efficiency.