SK Hynix holds groundbreaking ceremony for $4 billion Indiana AI chip packaging facility
South Korean chipmaker SK Hynix on Thursday held a groundbreaking ceremony for an advanced packaging and research facility in Indiana worth more than $4 billion, expanding its US footprint to meet growing demand for memory chips used in AI applications.
The facility, at the Purdue Research Park in West Lafayette, is scheduled to begin cleanroom operations in the second half of 2028, according to SK Hynix’s website and press statements.
A cleanroom is a highly controlled manufacturing space that keeps dust and other microscopic contaminants out during the chipmaking process.
