Samsung Electronics wins $200 billion Broadcom AI chip partnership, boosting foundry push

SEOUL, July 25 (Reuters) – Samsung Electronics said on Saturday it struck a pact with U.S. chip designer Broadcom to widen cooperation across memory chips, contract chip making and advanced packaging envisaged to exceed $200 billion until 2030.

Winning long-term production commitments from Broadcom, one of the world’s leading custom AI chip designers, could boost utilisation at Samsung’s advanced manufacturing facilities to pull ahead in the race to supply AI chips.