Cadence rolls out AI agent to speed circuit board, chip packaging design

Cadence Design Systems on Wednesday launched an artificial-intelligence “super agent” that designs printed circuit boards and chip packages, extending the company’s push to automate more of the engineering process.

The tool, called AuraStack, lets engineers describe their goals in plain language, then plans and carries out the work ‌using Cadence’s ⁠existing ⁠software tools to lay out and virtually test circuit designs. Cadence said Nvidia chips will accelerate the AI work.