June 3, 2026 – Page 6

Daily Archives: June 3, 2026

Marvell shares touch record high after Nvidia’s Huang calls it ‘next trillion-dollar company’

SpaceX negotiating underwriting fees below 1% for IPO: Report

STMicro lifts data centre revenue goals on AI demand, shares hit 25-year high

Claude AI down: Anthropic AI chatbot faces partial outage as users report access issues

Global Markets: South Korean shares post record-high close as Nvidia hopes lift tech stocks

SK Hynix pans to double wafer capacity in next five years, group chairman says

Polish ecommerce major Allegro secures $275 million EIB loan for AI, research and development

Arm says ByteDance, Oracle use its data centre CPU chips

Microsoft reveals new quantum chip made with AI, says it will have systems by 2029

Microsoft teases new era of AI-driven devices at software developer conference

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Google, Telstra partner on fibre and subsea networks in Australia

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Jio tops TRAI Delhi drive tests with 243.98 Mbps download speeds, leads in voice quality too

PCB makers seek 50% price hike as Iran war crushes supply chains

Japanese Renesas’ CTO Balaji Kanigicherla to quit

SK Hynix plans to double wafer capacity in next five years, group chairman says

Pay workers ‘as much as possible’, Nvidia’s Huang says

Nvidia has capacity to supply robust AI growth despite constraints, says CEO

Intel’s Alex Katouzian says competition from Nvidia PC chip a ‘good thing’

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Daily Archives: June 3, 2026

Marvell shares touch record high after Nvidia’s Huang calls it ‘next trillion-dollar company’

SpaceX negotiating underwriting fees below 1% for IPO: Report

STMicro lifts data centre revenue goals on AI demand, shares hit 25-year high

Claude AI down: Anthropic AI chatbot faces partial outage as users report access issues

Global Markets: South Korean shares post record-high close as Nvidia hopes lift tech stocks

SK Hynix pans to double wafer capacity in next five years, group chairman says

Polish ecommerce major Allegro secures $275 million EIB loan for AI, research and development

Arm says ByteDance, Oracle use its data centre CPU chips

Microsoft reveals new quantum chip made with AI, says it will have systems by 2029

Microsoft teases new era of AI-driven devices at software developer conference

Google, Telstra partner on fibre and subsea networks in Australia

Jio tops TRAI Delhi drive tests with 243.98 Mbps download speeds, leads in voice quality too

PCB makers seek 50% price hike as Iran war crushes supply chains

Japanese Renesas’ CTO Balaji Kanigicherla to quit

SK Hynix plans to double wafer capacity in next five years, group chairman says

Pay workers ‘as much as possible’, Nvidia’s Huang says

Nvidia has capacity to supply robust AI growth despite constraints, says CEO

Intel’s Alex Katouzian says competition from Nvidia PC chip a ‘good thing’

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Daily Archives: June 3, 2026

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