Liquid cooling startup ZutaCore raises $100 mn in Series C from Mitsubishi, Carrier, Samsung & others
ZutaCore, a direct-to-chip waterless liquid cooling solutions provider, said it has raised $100 million (~₹950 crore) in a Series C funding round, with participation from Mitsubishi Electric, Carrier Ventures, and Samsung Electronics.
South Korean Samsung participated via its corporate venture capital arm, Samsung Ventures. The round also included additional investors.
The US-based company said on Tuesday that the funding supports global commercialisation expansion as it scales to meet rapidly growing bookings and deployments driven by surging demand for AI and high-performance computing (HPC) infrastructure.
It will also advance research and development to address the evolving thermal requirements of next-generation chip architectures, drive innovation in in-package thermal management, enabling two-phase integration with existing air and single-phase systems, and support megawatt-class deployments.
ZutaCore’s waterless two-phase cooling platform can support AI and HPC processors exceeding 4,000 watts that power modern data centers.
The company has more than 75 deployments globally, across the Americas, Europe and Asia.
Further, ZutaCore strengthened its leadership team by appointing Sharon Shafran as the chief operating officer (COO), Yoni Nir as the chief research and development officer, Yaniv Reinhold as the chief financial officer (CFO), and Sarah Warshavsky Oberman as the chief people officer.
“$100 million of funding reflects strong validation from leading global partners and growing demand for our technology,” said Erez Freibach, chairman & CEO of ZutaCore. “With our expanding leadership team and continued innovation, we are well positioned to support the next generation of high-performance, sustainable data centers.”
