Taiwan’s MediaTek says it supports both TSMC and Intel’s advanced packaging technologies

TAIPEI: Taiwan chip designer MediaTek said on Friday it supports both TSMC’s and Intel’s advanced packaging technologies, allowing customers to choose between the two approaches.

“We’re one of the few custom silicon providers that support both (TSMC’s) CoWoS and (Intel’s) EMIB. We let ‌our ⁠customers choose,” MediaTek ⁠Senior Vice President Vince Hu told reporters in Taipei.

CoWoS, or Chip-on-Wafer-on-Substrate, is TSMC’s advanced packaging technology widely used for artificial intelligence chips, including those designed by Nvidia. EMIB, or Embedded Multi-die Interconnect Bridge, is Intel’s competing advanced packaging technology.