Tata Electronics plans to start chip packaging at upcoming Assam unit
Tata Electronics plans to start chip packaging for global automotive and industrial clients at its upcoming outsourced semiconductor assembly and test (OSAT) facility in Assam, said people aware of the matter, providing a boost to the country’s semiconductor manufacturing ambitions.
While the Tata Group company has already initiated small-scale shipments from its first commercial OSAT facility in Vemagal, Karnataka, the strategic pivot to the greenfield high-volume manufacturing unit in Jagiroad, Assam is aimed at building trust among global clients about the company’s capabilities while ensuring immediate scalability to meet surging automotive and industrial demand, the people said.
