Centre set to prioritise memory chips under Semicon Mission 2.0
India Semiconductor Mission (ISM) 2.0 will prioritise advanced memory packaging focussed on high bandwidth memory (HBM), officials told ET.
ISM 1.0 was launched in 2021 as a push towards semiconductor manufacturing, packaging and design units. While the government has kept the public focus of the ₹1-lakh crore second phase of the initiative on establishing the full semiconductor ecosystem, including design, equipment, materials and research and development, officials said potential investment applications for high bandwidth memory production will be given precedence.
