Projects under Design Linked Incentive for semiconductors showing signs of growth
New Delhi [India], January 4 (ANI): Projects supported under the government’s Design Linked Incentive (DLI) scheme are scaling rapidly, with 16 tape-outs, 6 ASIC chips, 10 patents, over 1,000 engineers engaged, and over 3x private investment leveraged.
Ministry of Electronics and Information Technology’s (MeitY) Design Linked Incentive (DLI) Scheme under the Semicon India Programme aims to build a self-reliant, globally competitive chip design ecosystem.
