Apple eyes Indian chipmakers for iPhone component assembly, packaging: Report

Apple has reportedly begun preliminary talks with Indian chipmakers to assemble and package iPhone components, according to a report by the Economic Times on Wednesday, citing sources familiar with the discussions.

This is the first time Apple is considering assembling and packaging some chips in India, the report said. It is not yet clear which chips will be packaged at the Sanand facility in Gujarat, but they are likely to be display-related chips.