First ‘Made in India’ semiconductor chip likely by December: MoS Jitin Prasada

The first-ever ‘Made in India’ semiconductor chips is expected to roll out of the assembly lines by the end of 2025, Jitin Prasada, Minister of State for Electronics and Information Technology, said.

“The first packaged chip is expected to be out by December, 2025,” the Minister said in response to a questionnaire from ANI, besides underlining the status of India’s nascent yet progressing semiconductor ecosystem.

The government has laid a pathway towards an India that will build chips for the world, aligned across the supply chain, from assembly/testing to design, and manufacturing to exports, the minister said.