LG Electronics dives into semiconductor equipment, developing HBM chip for AI applications

Seoul [South Korea], July 29 (ANI): LG Electronics is making a strategic push into the semiconductor equipment sector, focusing on building key machinery for producing high-bandwidth memory (HBM) chips essential for AI applications, as reported by the Korea Herald.

The South Korean tech firm recently confirmed that its in-house research team, the Production Engineering Research Institute, has begun developing a hybrid bonder, an advanced chip packaging device. The machine is intended for use in manufacturing HBM chips, which are central to powering AI technologies.