Japan says $550 billion package in trade deal could finance Taiwanese chipmaker in US
TOKYO: Japan’s $550 billion investment package agreed in this week’s U.S. tariff deal could help finance a Taiwanese firm building semiconductor plants in the U.S., Japan’s top trade negotiator Ryosei Akazawa said on Saturday.
Japan agreed to the sweeping U.S.-bound investment initiative, which includes equity, loans and guarantees, in exchange for lower tariffs on its exports to the U.S.
However, the structure of the scheme remains unclear.
