Firstsource Launches Agentic AI Studio – Beyond Agentic Workflow

German firm Infineon signs pact with CDIL to supply chips for power semiconductors

ZTE’s Minimalist Private 5G-A solution wins GSMA Foundry Innovation Award at the GLOMO Awards 2025

China Mobile, Alibaba Cloud and ZTE win the GSMA GLOMO “Open Gateway Challenge” award for capability exposure solution

China Unicom, YunHuan Technology and ZTE win the GSMA GLOMO “Best Mobile Innovation for Cities” award

Maharashtra to get space tech policy in three months, says CM Fadnavis

Starlink has asked Italy for access to more spectrum

Onsemi attempts to buy Allegro MicroSystems again for $6.46 billion

CM stresses on including AI in ITI institutions’ curriculum

CDIL partners with Infineon Technologies to package semiconductors in India

Malaysia discussing response to U.S. chip tariffs with companies, minister says

Delhi government to conduct cyber security audit of IT systems

MWC 2025: Intel launches new processors to fuel demand in commercial AI PC market

Microsoft withdrew some CoreWeave agreements over delivery issue: Report

Chipmaker TSMC’s CEO to hold press conference at Taiwan presidential office

Kalyani Powertrain partners with Compal for manufacturing of ‘X86 platform’ servers in India

60% of Indian enterprises expect advanced 5G services from telcos: Capgemini study

Jio’s growth could lift Reliance, but retail and oil businesses still lag: Pankaj Pandey