Tata Electronics, ASMPT sign pact for semiconductor equipment infra

Tata Electronics has signed a pact with ASMPT Singapore for establishing semiconductor assembly equipment infrastructure and solutions for its chip packaging units in Assam and Karnataka.

ASMPT will collaborate with Tata Electronics for workforce training, advancing service engineering infrastructure, automation, spare supports and boosting R&D initiatives in the area of wirebond, flip chip, advanced packaging and integrated system packaging.