SK Hynix says HBM3E 12-layer chips to start mass production this month

SK Hynix, the world’s second-largest memory chip maker, will start mass production of HBM3E 12-layer chips by the end of this month, a senior executive said on Wednesday.

Justin Kim, president and head of the company’s AI Infra division, made the comment at the Semicon Taiwan industry forum in Taipei.

In July, the South Korean company disclosed plans to ship the next versions of HBM chips – the 12-layer HBM3E – starting in the fourth quarter and the HBM4 starting in the second half of 2025.