US to award Amkor up to $400 million for chip packaging plant

The U.S. Commerce Department said on Friday it plans to award Amkor Technology up to $400 million in government grants to help fund the company’s planned $2 billion advanced semiconductor packaging facility in Arizona.

The plant is set to be the largest of its kind in the U.S. and when fully operational will package and test millions of chips for autonomous vehicles, 5G/6G and data centers.