Samsung has a plan to stop Exynos chips from overheating

Samsung may have a new cooling solution for the upcoming Exynos chipsets that power smartphones. According to a report by The Elec, the South Korean tech giant is working on a new chip packaging technology to stop Exynos chipsets from facing overheating issues.

What is this technology and how it will improve Exynos chips

Named fan-out wafer-level package-HPB (FOWLP-HPB), this tech involves attaching a type of heatsink, called a heat path block (HPB), to the top of the chipset. The report claims that this heatsink technology is derived from PCs and servers, and is expected to be used on the upcoming Exynos processors.