Samsung sets up development team for high bandwidth memory chips
By
Biju Kumar
Seoul: Samsung Electronics, the world’s largest memory chipmaker, has newly set up a unit dedicated to developing high bandwidth memory (HBM) in a bid to regain the leadership in the artificial intelligence (AI) semiconductor market, industry sources said on Thursday.
The new HBM development team, part of an organisational overhaul of the company’s semiconductor division, aims to consolidate R&D functions and strengthen research efforts, according to the sources.